Pc-concepts SHG2 DP User Manual download pdf (Page 84)

General Specifications Intel® SHG2 DP Server Board Technical Product Specification

Intel Order Number C11343-001 Revision 1.0

9. General Specifications

This chapter specifies the operational parameters and physical characteristics for the Intel

SHG2 server board.

This is a board-level specification only.

System specifications are beyond

the scope of this document.

9.1 Absolute Maximum Electrical and Thermal Ratings

Operation of the SHG2 server board at conditions, beyond those shown in the following table,

may cause permanent damage to the system (provided for stress testing only). Exposure to

absolute maximum rating conditions for extended periods may affect system reliability.

Table 59 lists the maximum component case temperatures for baseboard components that

could be sensitive to thermal changes. The operating temperature, current load, or operating

frequency could affect case temperatures. Maximum case temperatures are important when

considering proper airflow to cool the motherboard.

Table 59. Absolute Maximum Electrical and Thermal Specifications

Operating Temperature 5°C to +50°C

Storage Temperature -55°C to +150°C

Voltage on any signal with respect to ground -0.3V to V

+ 0.3V

3.3V supply voltage with respect to ground -0.3 to +3.63V

5V supply voltage with respect to ground -0.3 to +5.5V

Notes:

1. Chassis design must provide proper airflow to avoid exceeding Intel®

Xeon™ IHS (integrated heat spreader) maximum case temperature.

2. V

means supply voltage for the device.

Caution: An ambient temperature that exceeds the board’s maximum operating temperature by

5°C to 10°C might cause components to exceed their maximum case temperature. When

determining system compliance, considerations should be given for maximum rated ambient

temperatures.

Table 60. Thermal Specification for Key Components

Component Maximum Temperature

Intel® Xeon™ processor, rating to meet Flexible Motherboard

(FMB) guidelines.

78°C (thermal plate)

CMIC-LE 100°C (case)

CIOB-X2 100°C (case)

CSB5 100°C (case)

82550PM Ethernet Controller 85°C (case)

82544GC Gigabit Ethernet Controller 85°C (case)

Lithium battery 70°C (case)

Note: *The Intel® Xeon™ processor uses an IHS. Thermal specifications relate to processor operation

under maximum power dissipation conditions with the HIS installed.

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